Advance Packaging Technology Development Engineer (ATPDE)Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Job RequirementsExperience:More than 7 years experience in semiconductor manufacturing or a related field, with hands‐on experience in Semiconductor Packaging or Fab Frontend processes.
Experience with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.Education:Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field.
PhD/ Masters Degree is preferred.Technical Experience:Development experience in one or more areas of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/d...