■ Main Responsibilities

- Design and integrate post‑FAB and assembly processes; develop MTS(Manufacturing Test Specification) for the flow.

- Review product structure and process PRP(Process Reference Plan); conduct performance and reliability assessments; perform failure analysis(pFA).

- Develop commercialization‑ready package technologies and products(2.5‑D / 3‑D / 3.5‑D).

- Lead multi‑chip integration and system‑level package development.

- Create packages based on a thorough understanding of FAB, bump, and post‑FAB processes.

- Execute DOE(Design of Experiments) and statistical analysis; evaluate product characteristics and reliability; conduct failure analysis (pFA).

- Establish project milestones, manage risks, and drive product technology development.

¦ Required / Preferred Qualifications

- Fundamental knowledge of semiconductor package materials and hands-on integration development experienc...