Infineon Technologies in Singapore is offering an internship for students to be part of the package simulation team. The role focuses on conducting finite element analysis using software like Ansys and LS-DYNA, and evaluating AI/ML-based models to assist in package development.

Candidates should be pursuing a Master's in Mechanical Engineering or a relevant field and possess skills in Ansys, LS-DYNA, Python, and Visual Basic. The internship period is expected from June/July 2026 to December 2026.