**Job Details:**

**Job Description:**

**Yield Analysis and Defects Lead Engineer**

The Advanced Packaging Technology and Manufacturing (APTM) Yield Group is seeking a Yield Analysis and Defects Lead Engineer to drive yield and defect improvement initiatives across Intel's advanced packaging technology portfolio.

In this role, you will lead efforts to identify, analyze, and resolve yield-limiting mechanisms throughout technology development and high-volume manufacturing (HVM). You will work with large-scale datasets, advanced analytics, inline metrology systems, and cross-functional engineering teams to improve manufacturing processes, test methodologies, and defect detection capabilities.

The successful candidate will establish team priorities, influence technical roadmaps, drive results across organizational boundaries, and ensure progress toward key yield milestones. This position offers the opportunity to become a technical expert in adva...