You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals. You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes. Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams. Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction. Qualifications:
-PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 712 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes. -Hands on experi...