+ Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer

+ Support component-, board-, enclosure-, and sub-system–level thermal analysis for electronic products

+ Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs

+ Apply appropriate boundary conditions, material properties, and solver settings under guidance from senior engineers

+ Support steady-state and transient thermal analyses, including power ramp-up, duty cycles, and basic fault scenarios

+ Post-process and interpret simulation results to identify thermal risks, airflow issues, and design improvement opportunities

+ Assist in correlating simulation results with experimental data, lab measurements, or field observations

+ Prepare clear technical summari...