At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems—a critical barrier to scalable adoption.
Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that is both scalable and energy‑efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra‑low latency—unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement—it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Characterization Engineer for our lab in Switzerland (Lausanne).