Job Description1. Familiar to 2.5D or 3D PKG integration & development & mass production experience
2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal considerationRequirement1. Understanding TSMC, INTEL, OSAT 2.5D PKG technology
2. Understand TSMC, INTEL 3D PKG technology
3. Experience on chiplet architecture with integration flow