🌿 Back to all jobs

🥝 ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

onsemi | Seremban, Malaysia | Posted June 02, 2026

Job Description

onsemi is currently seeking a skilled and driven **NPI Engineer – Soldering Process, Diebond and Wirebond** to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smar...

Apply for This Position

Submit Application