**Job Summary:**

+ This job requires a full-time Staff engineer with strong engineering knowledge and skills in wire bond equipment and process for early engagement in technical problem-solving, cross-site collaboration to support NPD qualification and high-volume manufacturing (HVM)
+ Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages, ensuring robust manufacturability, reliability compliance, and alignment with technology roadmaps.
+ Good knowledge in Six Sigma methodology and the DMAIC approach.
+ Practice good quality system and production control.
+ Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.



**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as v...