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🥝 ENGR STAFF, PROCESS; PKG&ASSY

onsemi | seremban, Malaysia | Posted June 03, 2026

Job Description

Job Summary

  • New Package Technology and New Platform Module Development
  • Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
  • Good understanding of MRS and generate PRS with SCD definition.
  • Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
  • Familiar with DFM, to secure robust manufacturability with quality requirements.
  • Good understanding of power module package design rule, design rule update with new platform development.
  • Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
  • Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
  • Strong knowledge and in-depth understanding of devi...

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