You will work with the global Micron network to drive each silicon node's Packaging Product yield, quality improvement, and new product introduction (NPI) through technical expertise, business process management, and project execution.

Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.

Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

Maintain and enhance domain knowled...