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🥝 HBM Packaging Engineer – NPI & High-Speed Memory

Micron Technology, Inc | singapore, Singapore | Posted June 03, 2026

Job Description

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.

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