General Overview

Functional Area: Engineering

Career Stream: Design Engineering Hardware

SAP Short Name: LEN-ENG-DHW

Job Level: Level 08

IC/MGR: Individual Contributor

Direct/Indirect Indicator: Indirect

Detailed Description

1. Advanced PCB Design & Layout: Execute advanced layout for complex, high-density, and high-speed multi-layer boards (including HDI, blind/buried vias, and microvias).
2. Perform rigorous constraint management for critical high-speed interfaces such as DDRx, PCIe, LVDS, etc.
3. Optimize component placement for signal integrity (SI), power integrity (PI), thermal performance, and EMI/EMC control.
4. Develop high-quality designs for various board types, including rigid, flex, and rigid-flex configurations.
5. Closely collaborating with electrical and mechanical teams to interpret requirements, resolve design issues,...