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🥝 Lead Platform Packaging Engineer

Infineon Technologies AG | malacca city, Malaysia | Posted June 15, 2026

Job Description

Infineon Technologies AG in Malacca City is seeking a Package Design Engineer to lead technical definition activities for packaging projects. Candidates should have a Bachelor’s Degree in Engineering and at least 9 years of relevant experience in the IC/semiconductor field.

The role entails generating internal drawings, defining package requirements, and coordinating cost estimates. Infineon values diversity and offers an inclusive work environment.

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