Lead Solutions Engineer: SI/PI and Thermal Analysis – Belo Horizonte, Brazil.
Job Description
This position involves delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions primarily using Cadence SI/PI and Thermal tools Sigrity, Clarity and Celcius.
Responsibilities
- Work in a team environment creating and implementing 3DIC reference flows and designs.
- Apply advanced knowledge of advanced packaging signal and power integrity analysis tools and flows.
- Use Sigrity, Clarity and Celcius to support customers, applying strong problem‑solving skills with multiple 3DIC configurations.
- Knowledge of the CMOS sign‑off design flow is a plus.
Requirements
- Complete Bachelor’s degree in Electrical or Electronics Engineering.
- Experience with package design and Cadence SI/PI/Thermal tools.
- Strong knowledge of advanced packaging concepts.