**Job Details:**

**Job Description:**

**Who we are:**

_The_ **_Advanced Packaging Technology and Manufacturing (APTM)_** _organization is responsible for developing and enabling Intel’s next‑generation advanced packaging and test technologies. We deliver both technology development and high-volume manufacturing solutions that power Intel Foundry customers and future product roadmaps._

_Our mission is to advance Intel’s packaging leadership with_ **_predictable execution, world‑class engineering, and innovative tooling solutions_** _that enable breakthrough device architectures._

_We are seeking a highly motivated_ **_Mechanical Tooling Engineer_** _to join our cross‑functional team and contribute to the definition, design, and deployment of tooling and hardware solutions that enable advanced semiconductor packaging._

**In this role your key responsibilities will include but are not limited to:**

+ Drives technol...