Job Summary:
· Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.
· Key person responsible to align processes between R&D and Manufacturing.
· Establish process POR through set up, feasibility and characterization followed by package development procedure.
Responsibilities
Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry Troubleshooting the issue during development stage with analytical and technical skill Exploring new technology in the market and competitor movement. Develop process flow for new package development in semiconductor Qualifications & experience
Degree in Mechanical, Mechatronics Engineering, Electronic, Materials or relevant educational background. Minimum 5 years’ experienced in Semiconductor area KNO...