At Nexperia Manchester, we are expanding our Packaging team with the addition of a Package Competency Engineer. Primarily focused on the assembly, reliability and design of our Power MOSFET packaging, it is our aim to develop you into a subject matter expert. We offer you huge scope to develop and make a real impact on a global semiconductor manufacturer producing over 100 billion devices every year.

Please note this role is located in Manchester, UK, and we are able to offer visa sponsorship and relocation support to strong candidates.

What you will do

Our Package Competence Engineers are responsible for providing knowledge and expertise in semiconductor packaging and assembly to enhance the performance of our Power MOSFETs. Under the guidance of our Packaging Technical Director, Ding Yandoc, you will be(come) a subject matter expert on semiconductor packaging and assembly.

Duties will include: