Staff Package Design Engineer

Job Description

In this role, you will be at the intersection of silicon design and system implementation. You will play a critical part in designing and delivering next-generation, high-performance packaging solutions; including 2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, and QFP/QFN packages that power our industry-leading automotive SoCs, industrial IoT microcontrollers, and AI-forward computing platforms. This role demands strong technical depth in package layout execution, a deep understanding of manufacturability, and a collaborative mindset for cross-domain co-design with our global silicon, SI/PI, thermal, and reliability teams.

**Key Responsibilities**

+ Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA, SiP, WLCSP, and multi-chip modules.
+ Develop and maintain package CAD databases, ensuring strict accuracy and adherence to design guidelines, DFM (Des...