This role leads end-to-end integration of advanced semiconductor packaging platforms, with emphasis on 2.5D, 3D, and heterogeneous system integration. You will own the post-fabrication value chain-from wafer-level processes through assembly, qualification, and reliability-supporting high-performance applications in AI, HPC, networking, and automotive systems. Key Responsibilities Process Integration & Architecture Architect and integrate
post-FAB assembly flows
, ensuring seamless transition from wafer fabrication to package-level execution Define and standardize
Manufacturing Test Specifications (MTS)
and
Process Reference Plans (PRP) Drive cross-functional alignment across design, process, reliability, and manufacturing teams Advanced Packaging Development Lead development and commercialization of
2.5D/3D/3.5D packaging platforms
, including
heterogeneous multi-die integration Enable system-level integration across chiplets, interposers, and advanced substrate...