Req. ID: JR Principal Engineer, FE OCT CPEE ADT BOND

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer level bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.