We are seeking an experienced Principal Engineer Package Design Development to lead packages design and development for automotive products. This role provides technical leadership across cross-functional teams, drives design innovation and supports product development. Your Role Key responsibilities in your new role

• Package Design and Development: Design and develop Flip chip BGA and Wirebond BGA Package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: ...