Key Responsibilities:

1. Si-based 3D DRAM:

1) Novel Metals & Interconnect Strategy:

• Lead the research and integration of advanced low-resistivity conductive materials for sub-10nm metal line and interconnect applications.
• Focus on materials screening, physical property optimization (e.g. thermal stability and work function engineering), process optimization, and HVM readiness evaluation and preparation.

2) Advanced Junction Formation:

• Define the process for ultra-scaled junction formation.
• Develop low-thermal-budget process and technology to achieve precise doping profiles and activation, ensuring optimal device performance in HAR 3D structures.
• Develop novel characterization technologies for precise junction profile measurements in complex 3D structures.

3) 3D Architecture & Silicide Integration:

• Overcome challenges in high aspect ratio structures.
• Deve...