The

Principal RF/EM Engineer

will play a key leadership role in the design and development of advanced broadband RF circuits, ASIC packaging solutions, modules, and integrated systems. This role focuses on electromagnetic simulation, RF structure design, and validation of high-frequency interconnect technologies across multiple materials and substrate technologies.

The successful candidate will perform full-channel simulations and eye-diagram evaluations while collaborating with a multidisciplinary engineering team to create, optimize, and validate detailed 3D electromagnetic models. The position also involves proof-of-concept integration and evaluation board development supporting next-generation high-speed products.

Key Responsibilities

Design and develop packaging solutions for high-speed advanced ASIC devices, including substrate selection and comprehensive modeling of broadband passive structures such as PCBs, modules, and interconnect ...