Overview
Job Description:
Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (5nm, 3nm, 2nm and beyond). Responsibilities
Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000sW+) of advanced node cutting edge silicon products Research, develop, and productize new materials such as TIM, build-up-film, underfill etc. in support advanced node silicon (5nm & 3/2nm) POR definition Manage IC packaging activity from concept through development, qualification and high volume production Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology Implement, fine-tune, and productize newly developed technologies into HVM Create package design documentatio...