Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state‑of‑the‑art chip‑to‑wafer and wafer‑to‑wafer hybrid bonding processes, developing cutting‑edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Key Responsibilities