Responsibilities Drive quality and productivity improvement through process simplification, standardization, and robust system solutions. Lead continuous process improvement initiatives to meet customer requirements for quality, yield, output, and cycle time. Collaborate with customers and internal teams on process, material, and equipment development. Troubleshoot process issues and lead cross-functional improvement activities. Requirements Degree in Engineering with at least 3 years of process engineering experience in the semiconductor industry. Knowledge of JMP, SPC, 8D, MSA, FMEA, and DOE methodologies is preferred. Experience in Taping, Inline Back Grind, Laser Groove, and Wafer Saw processes is an advantage. Independent, self-driven, and committed team player with strong problem-solving skills. All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits. Please email your resume in a detailed MSWord format to (HIDDEN TEXT)tin...