We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. You'll work closely with cross-functional teams in the
Key Responsibilities:Perform package substrate design and analysis (SI/PI/routing)Collaborate with layout engineers, marketing, and global design teamsUse tools like HFSS, ADS for package modeling/simulationContribute during pre/post-sales processes

Why is This a Great Opportunity
This is an outstanding technology, great opportunity to learn. Growing company with a lot of IP. Everyone contributes.

Qualifications:BS in EE or related field; MS preferred8-10 years of experience in semiconductor package designStrong SI/PI analysis, modeling, and simulation skillsExcellent communication, teamwork, and presentation abilities

Preferred Skills:Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysisExperience with Hspice...