Build the foundation of nextgeneration semiconductor technologies.

• Support the development and optimization of semiconductor processes for advanced packaging applications, including thinfilm deposition (ALD, PECVD, PVD, ECP) and surface preparation
• Assist with planning and executing experiments, applying structured problem solving and basic DOE concepts
• Collect, analyze, and document experimental data to support process learning and improvement
• Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.
• Perform hands‑on work with process equipment under guidance, including basic troubleshooting and tool characterization
• Collaborate with cross‑functional teams such as equipment engineering, applications, and R&D to support process integration
• Contribute to technical documentation...