The Packaging & Testing Engineer supports translational semiconductor research by bridging advanced packaging process development with industry-relevant manufacturing practices. The role focuses on operational engineering control of back-end processes—including backgrinding, wafer dicing, molding, and package-level testing—within a research fab, pilot line, or packaging development environment. The engineer ensures process robustness, yield performance, and scalability for transfer to industrial partners, while maintaining operational discipline comparable to leading semiconductor assembly and test facilities (OSATs and IDMs). This position plays a key role in enabling advanced packaging integration, reliability validation, and high-yield manufacturing through joint development programs (JDPs) and technology transfer activities.
Roles & Responsibilities